Analysis, simulation, fabrication and characterization of reliable, robust and scalable compact cooling elements based on semiconductor nanostructures [ 2003-01-01 - 2006-12-31 ]

Research Grant

Researchers: Chao Zhang (Chief Investigator) ,  Roger Lewis (Chief Investigator)

Brief description Analysis, simulation, fabrication and characterization of reliable, robust and scalable compact cooling elements based on semiconductor nanostructures. Modern electronic, microelectronic and optoelectronic devices generally work better when they are cooler. We aim to develop a semiconductor nanostructure cooling element which directly integrates into existing devices. The solid-state cooling element will be reliable, robust, scalable and operate in any orientation. The basis of operation is thermionic emission - electrons are the working fluid. Our project combines (1) analysis and simulation, (2) fabrication of nanostructures and (3) experimental test-benching using optical and electrical methods. The outcome of this research has the potential to revolutionize cooling of modern electronic and photonic systems, from computer motherboards to mobile phones.

Funding Amount $195,000

Funding Scheme Discovery Projects

View this grant in the ARC Data Portal