Linkage Projects - Grant ID: LP140100344 [ 2014 - 2017 ]

Research Grant

[Cite as]

Researchers Prof Michael Heimlich; Prof Candace Lang; Prof Anthony Parker; Dr James Downes; Dr Simon Mahon; Mr Renato Morosin

Brief description This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project will deliver a miniaturized packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. In this way, the project will enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.

Funding Amount 450000

Funding Scheme Linkage Projects

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