Research Grant
[Cite as https://purl.org/au-research/grants/arc/LP140100344]
Researchers:
Anthony Parker
(Chief Investigator)
,
Candace Lang
(Chief Investigator)
,
James Downes
(Chief Investigator)
,
Michael Heimlich
(Chief Investigator)
,
Dr Simon Mahon
(Partner Investigator)
View all 6 related researchers
Brief description High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.
Funding Amount $450,000
Funding Scheme Linkage Projects
- PURL : https://purl.org/au-research/grants/arc/LP140100344
- ARC : LP140100344