grant

Linkage Projects - Grant ID: LP140100344 [ 2015-05-15 - 2020-12-31 ]

Research Grant

[Cite as https://purl.org/au-research/grants/arc/LP140100344]

Researchers: Anthony Parker (Chief Investigator) ,  Candace Lang (Chief Investigator) ,  James Downes (Chief Investigator) ,  Michael Heimlich (Chief Investigator) ,  Dr Simon Mahon (Partner Investigator)
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Brief description High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits. This project aims to revolutionise electronic packaging by depositing a thin, protective layer of diamond on top of high-performance, millimetre-wave and THz integrated circuits. Leveraging existing technology for removing heat from high-powered optical electronics, the project aims to deliver a miniaturised packaged chip, protected from the environment and ready for mounting in a system, without seriously degrading the circuit's performance as occurs in current packaging technologies. The project aims to enable cheaper and more energy-efficient applications as wide ranging as wireless HD video, multi-gigabit telecommunications, and black-body passive imaging technologies for security, defence, medical and agricultural applications.

Funding Amount $450,000

Funding Scheme Linkage Projects

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