Damage-Free Surfacing of Large Brittle Wafers with On-Machine Flatness Control [ 2007-02-01 - 2012-01-31 ]

Research Grant

Researchers: Dr Irena Zarudi (Chief Investigator) ,  Prof Liangchi Zhang (Chief Investigator) ,  Professor YuanTong Gu (Chief Investigator) ,  A/Prof Wei Gao (Partner Investigator)

Brief description Damage-Free Surfacing of Large Brittle Wafers with On-Machine Flatness Control. The knowledge gained from this research project will be of great value to the development of new generations of high-integrity semiconductor systems for high-speed telecommunication, large-scale computation, transport, biomedicine, agriculture, mining and security. The outcomes will have significant impact on the ultra-precision discipline scientifically and will sharpen the competitive edge of the Australian fabrication industry. The research will open up remarkable opportunities for young researchers to work in one of the most frontier fields in the 21st century.

Funding Amount $1,202,882

Funding Scheme Discovery Projects

View this grant in the ARC Data Portal